| 摘要 |
The present copper alloy for electronic/electric devices contains greater than 2 mass% to 36.5 mass% Zn, 0.1 mass% to 0.9 mass% Sn, 0.15 mass% to less than 1.0 mass% Ni, 0.005 mass% to 0.1 mass% P, and 0.001 mass% to 0.1 mass% Fe, the balance being obtained from Cu and unavoidable impurities, and in atom ratios, satisfies 3 < (Ni+Fe)/P < 30, 0.3 < Sn/(Ni+Fe) < 2.7, and 0.002 ≤ [Fe/Ni] < 0.6, and satisfies the atom ratio [Fe/Ni]P of the Fe content to the Ni content in a [Ni, Fe]-P-based deposit containing Fe, Ni and P with respect to the atom ratio [Fe/Ni] of the Fe content to Ni content in the alloy as a whole being 5 ≤ [Fe/Ni]P/[Fe/Ni] ≤ 200. |
