ALKENYLPHENOXY-SUBSTITUTED 1,1-DIPHENYLETHYLENES, PROCESSES FOR THEIR PREPARATION, AND THEIR USE

摘要

The present invention relates to compounds according to formula (I) and to heat-curable resin compositions based on polymaleimide resin systems comprising such compounds as comonomers:
wherein R 1 is hydrogen or an alkenylphenoxy group,
R 2 is an alkenylphenoxy group, and
R 3 is hydrogen or an alkyl group with 1 to 4 carbon atoms. The present invention also relates to crosslinked resins obtainable by curing such compositions. Compounds of the present invention can be used amongst others in fields like structural adhesives, matrix resins for fiber prepregs, moulding compounds, as well as structural and/or electrical composites.