| 摘要 |
PROBLEM TO BE SOLVED: To enable forming a bump with a flat tip even in a high-current-density condition or a metal film having good in-plane uniformity in plating a to-be-plated object, or a substrate, e.g. a semiconductor wafer.SOLUTION: A plating apparatus includes a plating tank 10 holding a plating solution, an anode 26 arranged so as to be immersed in the plating liquid in the plating tank 10, a holder 24 which holds a to-be-plated object W and arranges the object W at a position opposite to the anode 26, a paddle 32 which is arranged between the anode 26 and the object W held with the holder 24 and stirs the plating solution in the plating tank 10, a paddle support mechanism 396 supporting the paddle 32, a paddle drive part 42 which causes the paddle 32 to move reciprocally in parallel with the object W and a stroke varying mechanism 392 which varies the stroke of the reciprocal motion of the paddle 32. |
