| 摘要 |
PROBLEM TO BE SOLVED: To inhibit an electronic component from being exposed in the electronic device in which the electronic component is mounted on one surface and the other surface of a substrate and each electronic component is sealed by resin.SOLUTION: Electronic components 20, 30 mounted on the other surface 12 of a substrate 10 are sealed and a second resin 50 is formed whose portion on the side opposite to a substrate 10 side is flattened. Then, in a process for forming a first resin 40, after the substrate 10 is fixed and a resin material 40a constituting the first resin 40 is arranged in a space surrounded by a lower mold 120 and clamp dies 130 while abutting the flattened portion of the second resin 50 on one surface 110a of an upper mold 110, the lower mold 120 is moved toward the upper mold 110 and the first resin 40 is formed by curing the resin material 40a while applying molding pressure thereto. |
