| 摘要 |
PROBLEM TO BE SOLVED: To successfully divide a wafer without causing a crack or chip on a divided chip.SOLUTION: A method for dividing a wafer (W) into individual chips (C) along first and second division schedule lines (14a and 14b) crossing on a surface of the wafer (W) comprises the steps of: forming a first modified layer (25a) along the first division schedule line (14a) inside the wafer (W); forming a second modified layer (25b) along the second division schedule line (14b) closer to a surface side of the wafer (W) than the first modified layer (25a); and thinning the wafer (W) to a prescribed thickness (L) by grinding the wafer from the rear side thereof, applying grinding load to the first and second modified layers (25a and 25b), and dividing the wafer (W) along the first and second division schedule lines (14a and 14b) (grinding step). |
