Semiconductor chips, semiconductor chip packages including the same, and semiconductor systems including the same

摘要

Semiconductor chips are provided. The semiconductor chip includes a first data pad, a first data strobe pad and a second data pad sequentially arrayed from a command address pad in a first direction. In addition, the semiconductor chip includes a third data pad, a second data strobe pad and a fourth data pad sequentially arrayed from the command address pad in a second direction. Data are inputted and outputted through the first and fourth data pads or through the second and third data pads in a predetermined bit organization. Related semiconductor chip packages and semiconductor systems are also provided.

主权项

1. A semiconductor chip comprising:
a first data pad, a first data strobe pad and a second data pad sequentially arrayed from a command address pad in a first direction; and a third data pad, a second data strobe pad and a fourth data pad sequentially arrayed from the command address pad in a second direction, wherein data are inputted and outputted through the first and fourth data pads or through the second and third data pads in a predetermined bit organization.