发明名称 Method for Manufacturing Display Device and Method for Manufacturing Electronic Device
摘要 A method for manufacturing a display device is provided. The method includes: forming, between a first substrate and a second substrate, a light-emitting element including an electroluminescence layer and a wiring over which a peeling layer formed by using the material of the electroluminescence layer is provided; and peeling whole of the second substrate from the first substrate so that the peeling layer over the wiring is simultaneously exposed.
申请公布号 US2017077428(A1) 申请公布日期 2017.03.16
申请号 US201615363624 申请日期 2016.11.29
申请人 Semiconductor Energy Laboratory Co., Ltd. 发明人 Sakuishi Tatsuya;Nakamura Daiki;Chida Akihiro;Aoyama Tomoya
分类号 H01L51/00;H01L51/50;H01L27/32;H01L51/52 主分类号 H01L51/00
代理机构 代理人
主权项 1. An electronic device comprising: a first flexible substrate; an electrode over the first flexible substrate; a first insulating layer over the electrode; a first bonding layer over the first insulating layer; a second insulating layer over the first bonding layer; a second bonding layer over the second insulating layer; a second flexible substrate over the second bonding layer; and a conductive connection layer in contact with the electrode through a first opening opened in the first insulating layer and in the first bonding layer, and a second opening opened in the second flexible substrate, wherein the second bonding layer is in contact with a side surface of the conductive connection layer and a side surface of the first bonding layer.
地址 Kanagawa-ken JP
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