发明名称 |
Method for Manufacturing Display Device and Method for Manufacturing Electronic Device |
摘要 |
A method for manufacturing a display device is provided. The method includes: forming, between a first substrate and a second substrate, a light-emitting element including an electroluminescence layer and a wiring over which a peeling layer formed by using the material of the electroluminescence layer is provided; and peeling whole of the second substrate from the first substrate so that the peeling layer over the wiring is simultaneously exposed. |
申请公布号 |
US2017077428(A1) |
申请公布日期 |
2017.03.16 |
申请号 |
US201615363624 |
申请日期 |
2016.11.29 |
申请人 |
Semiconductor Energy Laboratory Co., Ltd. |
发明人 |
Sakuishi Tatsuya;Nakamura Daiki;Chida Akihiro;Aoyama Tomoya |
分类号 |
H01L51/00;H01L51/50;H01L27/32;H01L51/52 |
主分类号 |
H01L51/00 |
代理机构 |
|
代理人 |
|
主权项 |
1. An electronic device comprising:
a first flexible substrate; an electrode over the first flexible substrate; a first insulating layer over the electrode; a first bonding layer over the first insulating layer; a second insulating layer over the first bonding layer; a second bonding layer over the second insulating layer; a second flexible substrate over the second bonding layer; and a conductive connection layer in contact with the electrode through a first opening opened in the first insulating layer and in the first bonding layer, and a second opening opened in the second flexible substrate, wherein the second bonding layer is in contact with a side surface of the conductive connection layer and a side surface of the first bonding layer. |
地址 |
Kanagawa-ken JP |