| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer division method which reduces a possibility for a wafer to be damaged by grinding.SOLUTION: The division method includes: a groove forming step of forming a groove (21) deeper than a thickness of a finished chip along a predetermined dividing line (17) of a wafer (11); an affixing step of affixing a protective tape (23) to a front face (11a) of the wafer; a wafer holding step of holding a front side of the wafer with a holding table (10); a grinding step of grinding a rear face (11b) of the wafer with grinding means (12) while supplying grinding water (Wc and Wh) to the wafer held by the holding table; and a detection step of detecting that the wafer is divided into individual chips suring implementation of the grinding step. Before detecting the division of the wafer in the detection step, grinding is implemented with the grinding water (Wc) at a first temperature. After the division of the wafer is detected in the detection step, the wafer is ground by the grinding water (Wh) at a second temperature that is higher than the first temperature. |
