发明名称 |
MULTI-LAYER POLISHING PAD FOR CMP |
摘要 |
The invention is directed to a multi-layer polishing pad for chemical-mechanical polishing comprising a top layer, a middle layer and a bottom layer, wherein the top layer and bottom layer are joined together by the middle layer, and without the use of an adhesive. The invention is also directed to a multi-layer polishing pad comprising an optically transmissive region, wherein the layers of the multi-layer polishing pad are joined together without the use of an adhesive. |
申请公布号 |
EP3140852(A1) |
申请公布日期 |
2017.03.15 |
申请号 |
EP20150788762 |
申请日期 |
2015.04.30 |
申请人 |
Cabot Microelectronics Corporation;Mrzyglod, Brian;Nair, Jayakrishnan;Blake, Garrett |
发明人 |
MRZYGLOD, Brian;NAIR, Jayakrishnan;BLAKE, Garrett |
分类号 |
H01L21/304 |
主分类号 |
H01L21/304 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|