| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which inhibits the occurrence of warpage of a wafer with high efficiency.SOLUTION: A substrate processing apparatus for performing processing on a substrate by continuously rotating a rotary table in a state where the substrate is placed on a recess for substrate placement, the substrate being formed on a surface of the rotary table provided in a chamber in a substantially horizontal fashion, comprises: heating means arranged near a carry-in/carry-out region for placing the substrate on the rotary table, for heating the substrate; and control means for controlling the heating means to heat the substrate carried in the carry-in/carry-out region and on a surface on the side opposite to the substrate placement surface of the rotary table and in a region including at least an edge of the substrate. |
