| 摘要 |
PROBLEM TO BE SOLVED: To provide an integration-type tape for dicing and die bonding which is superior in resistance to laser, allows easy pickup of a chip, includes an adhesive layer having a sufficient stickiness, and enables a scribe line to be expanded well.SOLUTION: The integration-type tape for dicing and die bonding comprises: a base-material film layer (A) which includes at least 90 mass% polyethylene, and is arranged so that the ratio of a quantity of permanent deformation in a horizontal direction to a quantity of permanent deformation in a vertical direction with respect to a direction of film formation ((Quantity of horizontal permanent deformation)/(Quantity of vertical permanent deformation)) is between 0.90 and 1.10 inclusive; an adhesive layer (B) including an acrylic resin, and a crosslinking agent; and an adhesive layer (C). The acrylic resin includes an acrylic resin (b1) having a hydroxyl group and no aromatic group in a proportion of 90 mass% or more. The crosslinking agent includes a crosslinking agent (b2) having, in one molecule, two or more functional groups capable of reacting with a hydroxyl group and no aromatic group in a proportion of 80 mass% or more. The content of the crosslinking agent is between 3 and 15 pts.mass inclusive to 100 pts.mass of the acrylic resin. |
