| 摘要 |
PROBLEM TO BE SOLVED: To provide a single side polishing method of a wafer capable of improving planarity of outer periphery of the wafer.SOLUTION: In a single side polishing method of a wafer for polishing the single side of a wafer, by bringing the single side of a wafer, fixed to a plate by means of an adhesive, into contact with a polishing cloth provided on a surface plate, and then rotating the plate and the surface plate, solid content of the adhesive has a softening point in a range of 70-76°C, and fluid viscosity at 100°C is in a range of 20000-35000 cP. |
