ダミーフレーム、樹脂モールド評価方法、モールド金型の評価方法、およびモールド金型の製造方法

摘要

PROBLEM TO BE SOLVED: To provide a dummy frame by which sealing resin of a semiconductor chip can be evaluated with high accuracy without using an actual semiconductor mounting substrate.SOLUTION: A dummy frame 110 is a dummy frame used for evaluating mold resin of a semiconductor mounting substrate mounting at least one semiconductor chip. The dummy frame 110 includes: a planar metal plate 100 simulating the semiconductor mounting substrate; and at least one convex 120 simulating the semiconductor chip and being mounted on the metal plate 100.SELECTED DRAWING: Figure 3