发明名称 |
METHOD FOR PRODUCING SUBSTRATE FOR SEMICONDUCTOR LIGHT EMITTING ELEMENTS, METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING ELEMENT, SUBSTRATE FOR SEMICONDUCTOR LIGHT EMITTING ELEMENTS, AND SEMICONDUCTOR LIGHT EMITTING ELEMENT |
摘要 |
Provided are: a method for manufacturing a substrate for semiconductor light emitting elements, the substrate being capable of improving the light extraction efficiency of a semiconductor light emitting element; a method for manufacturing a semiconductor light emitting element; a substrate for semiconductor light emitting elements; and a semiconductor light emitting element. This substrate (11) for semiconductor light emitting elements has a light emitting structure formation surface (11S) on which a light emitting structure containing a semiconductor layer is formed, and the light emitting structure formation surface (11S) is provided with a flat part (14) that spreads along one crystal plane, a plurality of large-diameter projections (12) that project from the flat part (14), and a plurality of small-diameter projections (13) that are smaller than the large-diameter projections (12). At least some of the plurality of small-diameter projections (13) project from the outer surfaces of the large-diameter projections (12). |
申请公布号 |
EP3057144(A4) |
申请公布日期 |
2017.03.08 |
申请号 |
EP20140851533 |
申请日期 |
2014.10.09 |
申请人 |
Oji Holdings Corporation |
发明人 |
KAJITA, Yasuhito;SHINOTSUKA, Kei;DAI, Kotaro |
分类号 |
H01L33/22;H01L33/00 |
主分类号 |
H01L33/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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