Transparent conductive film and manufacturing method therefor

摘要

The present invention is a transparent conductive film having a flexible transparent base and a transparent conductive layer made of a crystalline conductive metal oxide that is formed on one surface of the flexible transparent base, in which the thickness of the flexible transparent base is 80 μm or less, and the difference H1−H2 between the dimensional change rate H1 when the transparent conductive film is heated at 140° C. for 30 minutes and the dimensional change rate H2 when the transparent conductive layer is removed from the transparent conductive film by etching and the transparent conductive film is heated at 140° C. for 30 minutes is −0.02 to 0.043%. Because of that, the level difference at the pattern boundary when the film is assembled into a touch panel, etc. is decreased and the deterioration of the appearance can be also suppressed.

主权项

1. A transparent conductive film having a flexible transparent base and a transparent conductive layer made of a crystalline conductive metal oxide that is formed on one surface of the flexible transparent base, wherein
the transparent conductive layer is formed by a sputtering method, the thickness of the flexible transparent base is 80 μm or less, and the difference H1−H2 between the dimensional change rate H1 when the transparent conductive film is heated at 140° C. for 30 minutes and the dimensional change rate H2 when the transparent conductive layer is removed from the transparent conductive film by etching and the transparent conductive film is heated at 140° C. for 30 minutes is −0.043 to 0.02%, a thickness of the transparent conductive layer is 10 to 30 nm, the flexible transparent base has a transparent film base, the transparent conductive film has at least one undercoat layer provided between the transparent film base and the transparent conductive layer, the undercoat layer is formed of an inorganic substance, an organic substance, or a mixture of inorganic and organic substances, the transparent conductive layer is patterned and is bonded to a glass plate with an acrylic-based pressure-sensitive adhesive layer, wherein a level difference at a boundary between a pattern forming part where the transparent conductive layer is formed and a pattern opening part where the transparent conductive layer is removed is 52-168 nm.