发明名称 |
Liquid ejecting head, liquid ejecting apparatus, and method of manufacturing liquid ejecting head |
摘要 |
A liquid ejecting head comprising: a head body that ejects liquid droplets from a liquid ejecting surface; a wiring substrate electrically connected to the head body; a holder member to which the head bodies are fixed, and that includes a flow channel to the head bodies, and a wiring through hole through which the wiring substrate passes; a circuit substrate that includes a connection portion electrically connected to the wiring substrate, and a substrate that arranges the connection portion on both surfaces thereof and stands in a direction intersecting the liquid ejecting surface; a set of a first correction plate facing each other with respect to each of both surfaces of the substrate of the circuit substrate for correcting the holder member; and a cover member that accommodates the circuit substrate fixed to the holder member and the first correction plate. |
申请公布号 |
US9586402(B2) |
申请公布日期 |
2017.03.07 |
申请号 |
US201514645948 |
申请日期 |
2015.03.12 |
申请人 |
Seiko Epson Corporation |
发明人 |
Komatsu Yuko;Kinoshita Ryota;Takino Fumiya |
分类号 |
B41J2/14;B41J2/16;B41J2/155 |
主分类号 |
B41J2/14 |
代理机构 |
Kilpatrick Townsend & Stockton LLP |
代理人 |
Kilpatrick Townsend & Stockton LLP |
主权项 |
1. A liquid ejecting head comprising:
a first head main body that ejects liquid droplets from a liquid ejecting surface; a wiring substrate electrically connected to the first head main body; a holder member to which a plurality of head main bodies, including the first head main body, are fixed, and that includes a flow channel to the first head main body, and a wiring through hole through which the wiring substrate passes; a circuit substrate that includes a substrate and connection portions electrically connected to the wiring substrate, wherein the connection portions are provide on both surfaces of the substrate and the substrate is perpendicular to a liquid ejecting surface of the plurality of head main bodies; a set of first correction plates facing each other with respect to each of both surfaces of the substrate of the circuit substrate for correcting warping of the holder member; and a cover member that accommodates the circuit substrate fixed to the holder member and the first correction plates. |
地址 |
Tokyo JP |