发明名称 Liquid ejecting head, liquid ejecting apparatus, and method of manufacturing liquid ejecting head
摘要 A liquid ejecting head comprising: a head body that ejects liquid droplets from a liquid ejecting surface; a wiring substrate electrically connected to the head body; a holder member to which the head bodies are fixed, and that includes a flow channel to the head bodies, and a wiring through hole through which the wiring substrate passes; a circuit substrate that includes a connection portion electrically connected to the wiring substrate, and a substrate that arranges the connection portion on both surfaces thereof and stands in a direction intersecting the liquid ejecting surface; a set of a first correction plate facing each other with respect to each of both surfaces of the substrate of the circuit substrate for correcting the holder member; and a cover member that accommodates the circuit substrate fixed to the holder member and the first correction plate.
申请公布号 US9586402(B2) 申请公布日期 2017.03.07
申请号 US201514645948 申请日期 2015.03.12
申请人 Seiko Epson Corporation 发明人 Komatsu Yuko;Kinoshita Ryota;Takino Fumiya
分类号 B41J2/14;B41J2/16;B41J2/155 主分类号 B41J2/14
代理机构 Kilpatrick Townsend & Stockton LLP 代理人 Kilpatrick Townsend & Stockton LLP
主权项 1. A liquid ejecting head comprising: a first head main body that ejects liquid droplets from a liquid ejecting surface; a wiring substrate electrically connected to the first head main body; a holder member to which a plurality of head main bodies, including the first head main body, are fixed, and that includes a flow channel to the first head main body, and a wiring through hole through which the wiring substrate passes; a circuit substrate that includes a substrate and connection portions electrically connected to the wiring substrate, wherein the connection portions are provide on both surfaces of the substrate and the substrate is perpendicular to a liquid ejecting surface of the plurality of head main bodies; a set of first correction plates facing each other with respect to each of both surfaces of the substrate of the circuit substrate for correcting warping of the holder member; and a cover member that accommodates the circuit substrate fixed to the holder member and the first correction plates.
地址 Tokyo JP