| 发明名称 |
PALLADIUM (PD)-COATED COPPER WIRE FOR BALL BONDING |
| 摘要 |
A palladium coated copper wire for ball bonding includes a core formed of pure copper or copper alloy having a purity of 98% by mass or more, and a palladium draw coated layer coated on the core. The copper wire has a diameter of 10 to 25 μm, and the palladium drawn layer contains sulfur, phosphorus, boron or carbon. |
| 申请公布号 |
US2017057020(A1) |
申请公布日期 |
2017.03.02 |
| 申请号 |
US201615248196 |
申请日期 |
2016.08.26 |
| 申请人 |
TANAKA DENSHI KOGYO K.K. |
发明人 |
AMANO Hiroyuki;YARITA Somei;SAKITA Yusuke;ANTOKU Yuki;CHEN Wei |
| 分类号 |
B23K35/02;C22C9/00;C22C5/04;C22C5/02;B23K35/30;B21C1/02;C22F1/14;C25D3/50;C23C14/16;C23C14/35;C23C26/00;B32B15/01;C22C9/06;C22F1/08 |
主分类号 |
B23K35/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A palladium coated copper wire for ball bonding, comprising:
a core formed of pure copper or copper alloy having a purity of 98% by mass or more, and a palladium draw coated layer coated on the core, wherein the copper wire has a diameter of 10 to 25 μm, and the palladium drawn coated layer contains sulfur, phosphorus, boron or carbon. |
| 地址 |
Kanzaki-gun JP |
