An optical module comprises a drive chip (41), a transmission optical chip (42), and a circuit board (43). A lead point of the transmission optical chip (42) and a light-emitting hole are located on a same side. The lead point of the transmission optical chip (42) and a lead point of the drive chip (41) are in contact with the circuit board (43) separately. The lead point of the transmission optical chip (42) and the lead point of the drive chip (41) are located on a same horizontal plane. The lead point of the transmission optical chip (42) and the lead point of the drive chip (41) are connected by means of a wire (44) on the circuit board (43). A through hole is formed in the circuit board (43). A light beam transmitted by the light-emitting hole of the transmission optical chip (42) passes through the through hole. By arranging the lead point of the transmission optical chip (42) and the lead point of the drive chip (41) on the same horizontal plane, the length of the leads between the transmission optical chip (42) and the drive chip (41) is reduced, thereby reducing lead crosstalk between channels.
