发明名称 FLOATING BODY MEMORY CELL HAVING GATES FAVORING DIFFERENT CONDUCTIVITY TYPE REGIONS
摘要 A method for fabricating floating body memory cells (FBCs), and the resultant FBCs where gates favoring different conductivity type regions are used is described. In one embodiment, a p type back gate with a thicker insulation is used with a thinner insulated n type front gate. Processing, which compensates for misalignment, which allows the different oxide and gate materials to be fabricated is described.
申请公布号 US2017062434(A1) 申请公布日期 2017.03.02
申请号 US201615349862 申请日期 2016.11.11
申请人 Chang Peter L. D.;Avci Uygar E.;Kencke David;Ban Ibrahim 发明人 Chang Peter L. D.;Avci Uygar E.;Kencke David;Ban Ibrahim
分类号 H01L27/108;H01L29/16;H01L29/49;H01L29/51;H01L27/092;H01L29/06 主分类号 H01L27/108
代理机构 代理人
主权项 1. A semiconductor structure, comprising: a semiconductor substrate comprising an N well region having a first semiconductor fin and a second semiconductor fin protruding therefrom, the first semiconductor fin spaced apart from the second semiconductor fin; a trench isolation layer disposed on the semiconductor substrate between the first and second semiconductor fins, wherein the first and second semiconductor fins extend above the trench isolation layer; a gate dielectric layer disposed on the first and second semiconductor fins and on the trench isolation layer, wherein the gate dielectric layer is continuous between the first and second semiconductor fins; a p type metal gate layer disposed over the gate dielectric layer over the first semiconductor fin, over the second semiconductor fin and over the trench isolation layer, wherein the p type metal gate layer is continuous between the first and second semiconductor fins; and an n type metal gate layer disposed over the p type metal gate layer over the first semiconductor fin, over the second semiconductor fin and over the trench isolation layer, wherein the n type metal gate layer is continuous between the first and second semiconductor fins.
地址 Portland OR US