| 发明名称 |
RESIN-COATED COPPER FOIL FOR MANUFACTURING A PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD USING THE SAME |
| 摘要 |
A resin-coated copper foil includes: a copper foil layer including a first surface and a second surface, wherein a laser absorptance of the first surface of the copper foil layer is greater than a laser absorptance of the second surface of the copper foil layer, and wherein ribs are formed on the second surface of the copper foil layer; a carrier film disposed on the first surface of the copper foil layer; a primer resin layer disposed on the second surface of the copper foil layer; and a build-up resin layer disposed on the primer resin layer. |
| 申请公布号 |
US2017064841(A1) |
申请公布日期 |
2017.03.02 |
| 申请号 |
US201615164191 |
申请日期 |
2016.05.25 |
| 申请人 |
Samsung Electro-Mechanics Co., Ltd. |
发明人 |
HAN Youn-gyu |
| 分类号 |
H05K3/46;H05K1/03;H05K1/02;H05K3/40;H05K3/00;H05K1/09;H05K3/02 |
主分类号 |
H05K3/46 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A resin-coated copper foil, comprising:
a copper foil layer comprising a first surface and a second surface, wherein a laser absorptance of the first surface of the copper foil layer is greater than a laser absorptance of the second surface of the copper foil layer, and wherein ribs are formed on the second surface of the copper foil layer; a carrier film disposed on the first surface of the copper foil layer; a primer resin layer disposed on the second surface of the copper foil layer; and a build-up resin layer disposed on the primer resin layer. |
| 地址 |
Suwon-si KR |
