2.5D electronic package

摘要

A 2.5D electronic package is provided in which at least one integrated circuit is mounted on an interposer that is mounted on a package substrate. To reduce warpage, the interconnection array of the integrated circuit does not include a thick metallization layer; and at least part of the power distribution function that would otherwise have been performed by the thick metallization layer is performed by one or more metallization layers that are added to the interposer. A method is provided for optimizing the design of the electronic package by choosing the appropriate number of metallization layers to be added to the interposer.

主权项

1. A device package comprising:
a package substrate having first and second major surfaces; an integrated circuit having first and second major surfaces with a plurality of active devices formed in the first major surface, the integrated circuit being mounted in the package so that the first major surface of the integrated circuit faces the package substrate; a first plurality of interconnection layers and intermetallic dielectric layers formed on the first major surface of the integrated circuit, an uppermost interconnect layer having a thickness no greater than that of any other interconnect layer; and an interposer located between the integrated circuit and the package substrate with the integrated circuit mounted thereon, the interposer having at least one interconnection layer that is used primarily for power distribution in the integrated circuit, wherein the at least one interconnection layer that is used primarily for power distribution in the integrated circuit extends across an entire width of the interposer.