Integrated device package comprising conductive sheet configured as an inductor in an encapsulation layer

摘要

An integrated device package includes a package substrate, a die coupled to the package substrate, an encapsulation layer encapsulating the die, and at least one sheet of electrically conductive material configured to operate as an inductor. The sheet of electrically conductive material is at least partially encapsulated by the encapsulation layer. The sheet of electrically conductive material is configured to operate as a solenoid inductor. The sheet of electrically conductive material includes a first sheet portion, a second sheet portion coupled to the first sheet portion, where the first sheet portion and the second sheet portion form a first winding of the inductor, a first terminal portion coupled to the first sheet portion, and a second terminal portion coupled to the second sheet portion. The first sheet portion is formed on a first level of the sheet. The second sheet portion is formed on a second level of the sheet.

主权项

1. A device package comprising:
a package substrate; a die coupled to the package substrate; an encapsulation layer encapsulating the die; andat least one sheet of electrically conductive material configured to operate as an inductor, wherein the at least one sheet of electrically conductive material is at least partially encapsulated by the encapsulation layer; and wherein the at least one sheet of electrically conductive material comprises:
a first sheet portion; a second sheet portion coupled to the first sheet portion and substantially parallel to the first sheet portion, wherein the first sheet portion and the second sheet portion form a first winding of the inductor.