| 摘要 |
An equipment system using a deformable organic silicone resin photoconverter to bond-package an LED comprises: a roll-pressing device configured to refine photoconversion films (8-6); a roll-shaping device configured to perform heated roll-shaping on the refined photoconversion films (8-6); a film-melting device (3) configured to perform film-melting on the refined photoconversion films (8-6) having undergone the roll-shaping; and a roll-bonding device configured to oppositely align and roll-bond the refined photoconversion films having undergone the film-melting and an LED flip-chip array having a carrier film. The roll-pressing device, the roll-shaping device, the film-melting device and the roll-bonding device are sequentially disposed and constitute a cooperatively-linked process equipment. The equipment system continuously rolls to bound-package an LED, and can satisfy a requirement of a process method applicable to the use of a deformable organic silicone resin photoconverter to bond-package an LED, thereby increasing production efficiency and yield of LED packages in an industrialized batch production. |
