| 发明名称 |
INTEGRATED CIRCUIT PACKAGE |
| 摘要 |
An integrated circuit (“IC”) package including at least one IC die having a first side with at least two adjacent bump pads thereon and a second side opposite the first side; a first substrate having a first side with a plurality of electrical contact surfaces thereon; and a plurality of copper pillars, each having a first end attached to one of the adjacent bump pads and a second end attached to one of the electrical contact surfaces. |
| 申请公布号 |
US2017053883(A1) |
申请公布日期 |
2017.02.23 |
| 申请号 |
US201615254948 |
申请日期 |
2016.09.01 |
| 申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
How You Chye;Tay Huay Yann |
| 分类号 |
H01L23/00;H01L23/495;H01L21/48;H01L23/31 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An integrated circuit (IC) package comprising:
an IC die having a first side and a second side opposite the first side; a bump pad on the first side; a first substrate having a first side with a plurality of electrical contact surfaces; a plurality of metal pillars, each having a first end attached to the bump pad via a passivation layer, and a second end attached to one of a plurality of electrical contact surfaces of a first substrate; an intermetallic compound surrounding portions of the plurality of metal pillars; and a mold compound encapsulating the intermetallic compound. |
| 地址 |
Dallas TX US |
