| 发明名称 |
SENSING CHIP |
| 摘要 |
A sensing chip is provided, which includes a substrate and a plurality of nano structures periodically arranged on the substrate, wherein each of the nano structures includes a bottom metal layer disposed on the substrate, a middle dielectric layer disposed on the bottom metal layer, and a top metal layer disposed on the middle dielectric layer. The bottom metal layer has an area that is larger than that of the top metal layer. |
| 申请公布号 |
US2017052114(A1) |
申请公布日期 |
2017.02.23 |
| 申请号 |
US201514831248 |
申请日期 |
2015.08.20 |
| 申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
LIN Ding-Zheng;CHEN Yi-Ping;CHEN Ping-Chen |
| 分类号 |
G01N21/552 |
主分类号 |
G01N21/552 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A sensing chip, comprising:
a substrate; and a plurality of nano structures periodically arranged on the substrate, wherein each of the nano structures includes a bottom metal layer disposed on the substrate, a middle dielectric layer disposed on the bottom metal layer, and a top metal layer disposed on the middle dielectric layer, wherein the bottom metal layer has an area that is larger than that of the top metal layer. |
| 地址 |
Hsinchu TW |
