发明名称 MEMS PRESSURE GAUGE CHIP AND MANUFACTURING METHOD THEREOF
摘要 A pressure gauge, comprising a cavity body (33) and a MEMS pressure gauge chip provided therein, the pressure gauge chip comprising a substrate (1), a component portion (2) and a covering plate (3) connected to each other. A silica layer (4) is formed between the substrate (1) and the component portion (2) and between the component portion (2) and the covering plate (3). The substrate (1) and the covering plate (3) are respectively formed with recess portions (5) thereon. The recess portion (5) of the substrate (1) is connected to the recess portion (5) of the covering plate (3) to form a cavity, and the component portion (2) is disposed within the cavity. The component portion (2) comprises a bridge portion (21) and a piezoresistive measuring element (23). The piezoresistive measuring element (23) is provided on the bridge portion (21). The pressure gauge chip is not greatly affected by temperature, can be used in a high temperature environment, has a high detection accuracy, high reliability and a low manufacturing cost. Also disclosed is a MEMS pressure gauge chip manufacturing process.
申请公布号 WO2017028465(A1) 申请公布日期 2017.02.23
申请号 WO2016CN00369 申请日期 2016.07.08
申请人 INSTITUTE OF GEOLOGY AND GEOPHYSICS, CHINESE ACADEMY OF SCIENCES 发明人 CHAU, Kevin;WONG, Man
分类号 G01L9/04;B81B3/00;B81C1/00;B81C3/00;G01B7/16 主分类号 G01L9/04
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