发明名称 SUBSTRATE FOR LED PACKAGING, LED PACKAGE, AND LED BULB
摘要 A substrate (1) for LED packaging, an LED package (40), and an LED bulb. The substrate (1) is in a strip shape, at least one end of the substrate (1) is provided with an electrode leading wire (2), and the electrode leading wire (2) is connected to the substrate (1) by a connecting component (3) and/or a connecting material, wherein at least one hole (5) arranged along the length direction of the substrate (1) is provided on the substrate (1). The LED package (40) comprises the substrate (1), the substrate (1) is provided with a plurality of LED chips (10), and the plurality of LED chips (10) is connected in series and/or in parallel with each other by connecting wires (11). The LED bulb has the LED package (40). A hole (5) on the middle part of the substrate (1) makes arrangement and control of LED chips (10) on the substrate (1) more simple and diversified, thereby aiding in air ventilation and heat dissipation of the LED package (40), making the service life of the LED bulb longer, and making a light emitting angle more all-dimensional.
申请公布号 WO2017028740(A1) 申请公布日期 2017.02.23
申请号 WO2016CN94806 申请日期 2016.08.12
申请人 YEUNG, Andrew 发明人 YEUNG, Andrew
分类号 F21S2/00;F21V19/00;F21V23/00;F21V29/83;H01L33/48;H01L33/62;H01L33/64 主分类号 F21S2/00
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