| 摘要 |
There is provided a defect inspection apparatus including: an electron scanning unit configured to scan a surface of a sample with an electron beam; a plurality of detectors arranged around an optical axis of the electron beam and configured to detect electrons emitted from the surface of the sample by scanning the electron beam; a signal processing unit configured to generate image data of the surface of the sample based on detection signals from the detectors; an analysis unit configured to detect a defect due to irregularities of the surface of the sample based on the image data; and a control unit configured to control a scanning speed of the electron beam depending on the type of the sample. |
