| 摘要 |
The invention provides a photo-curable resin composition, a dry film, a cured product thereof, and a printed wiring board using the same. The composition can be peeled with aqueous alkaline even being UV-curable and heat-curable resistant-soldering cured film and the substrate thereof can also be re-utilized. According to requirements, the photocurable resin composition contains (A) poly (methyl) acrylate as a conventional phototonus components (as a derivative from poly (methyl) acrylate excluding a compound represented the structure as the general formula (1), while the composition contains any one or more than two selected from a derivative represented by the following general formula (1), (B) carboxylic acid resin, (C) poly (meth) acrylic ester and (D) epoxy resin. |
