发明名称 基板処理装置、半導体装置の製造方法及び基板処理方法
摘要 According to the present disclosure, it is possible to prevent particles from being generated and to improve substrate processing quality. A substrate processing apparatus includes cassette mounting unit on which process substrate cassette and dummy substrate cassette are mounted, the process substrate cassette being configured to accommodate a plurality of process substrates, and the dummy substrate cassette being configured to accommodate a plurality of dummy substrates, process chamber configured to process the process substrates and the dummy substrates, substrate support unit installed within the process chamber and provided with a plurality of substrate mounting portions where the process substrates and the dummy substrates are mounted, transfer unit configured to transfer the process substrates and the dummy substrates between the cassette mounting unit and the process chamber, and control unit configured to control substrate processing and to transfer processing of the process substrates and the dummy substrates.
申请公布号 JP6084202(B2) 申请公布日期 2017.02.22
申请号 JP20140503788 申请日期 2013.02.27
申请人 株式会社日立国際電気 发明人 佐藤 武夫
分类号 H01L21/31;C23C16/52;H01L21/316;H01L21/677;H01L21/683 主分类号 H01L21/31
代理机构 代理人
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