Bond head assemblies, thermocompression bonding systems and methods of assembling and operating the same

摘要

A bond head assembly for bonding a semiconductor element to a substrate is provided. The bond head assembly includes a base structure, a heater, and a clamping system securing the heater to the base structure. The clamping system includes a plurality of elastic elements constraining the heater along a plurality of axes.

主权项

1. A bond head assembly for bonding a semiconductor element to a substrate, the bond head assembly comprising:
a base structure; a heater; and a clamping system securing the heater to the base structure, the clamping system including a plurality of elastic elements constraining the heater along a plurality of axes, wherein the plurality of elastic elements are configured to maintain the heater in a substantially balanced state along at least one of the plurality of axes of the bond head assembly, such that an elastic force acting on the heater is substantially equal along the at least one axis of the bond head assembly.