Semiconductor device and method for manufacturing the same

摘要

A method for manufacturing a semiconductor device is disclosed. The method comprises: forming a T-shape dummy gate structure on the substrate; removing the T-shape dummy gate structure and retaining a T-shape gate trench; forming a T-shape metal gate structure by filling a metal layer in the T-shape gate trench. According to the semiconductor device manufacturing method disclosed in the present application, the overhang phenomenon and the formation of voids are avoided in the subsequent metal gate filling process by forming a T-shape dummy gate and a T-shape gate trench, and the device performance is improved.

主权项

1. A method for manufacturing a semiconductor device, comprising:
forming a T-shape dummy gate structure on a substrate; removing the T-shape dummy gate structure to form a T-shape gate trench; and forming a T-shape metal gate structure by filling a metal layer in the T-shape gate trench wherein the step of forming the T-shape dummy gate structure further comprises: forming a dummy gate stack structure consisting of a gate insulation layer and a dummy gate layer on the substrate; forming a gate spacer on both sides of the dummy gate stack structure, and the height of the gate spacer is less than the height of the dummy gate structure to expose the top of the dummy gate structure; and forming a dummy gate epitaxial layer on both the exposed top and side of the dummy gate stack structure, wherein the dummy gate epitaxial layer and the dummy gate layer together constitute the T-shape dummy gate structure, wherein an S/D epitaxial layer is formed on both sides of gate spacer when the dummy gate epitaxial layer is formed.