发明名称 基板処理方法および基板処理装置
摘要 A substrate treatment method includes a rinsing step of supplying a rinse liquid to a front surface of a substrate while rotating the substrate at a first rotation speed, a liquid mixture film forming step of forming a liquid film of a liquid mixture of water and an organic solvent having a smaller surface tension than the water on the front surface after the rinsing step by supplying the water and the organic solvent to the front surface while reducing the rotation speed of the substrate from the first rotation speed to a second rotation speed lower than the first rotation speed, and an organic solvent replacing step of replacing the liquid mixture supplied to the front surface with the organic solvent after the liquid mixture film forming step by supplying the organic solvent to the front surface.
申请公布号 JP6080291(B2) 申请公布日期 2017.02.15
申请号 JP20120218405 申请日期 2012.09.28
申请人 株式会社SCREENホールディングス 发明人 藤井 達也
分类号 H01L21/304;H01L21/027;H01L21/306;H01L21/308 主分类号 H01L21/304
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