发明名称 Apparatus, method and system for a modular light-emitting diode circuit assembly
摘要 Provided herein is an improved apparatus, method and system for providing a modular LED circuit assembly. Specifically, examples of the present invention include a modular LED circuit which may be scaled and used in a wide variety of form factors. One example of the present invention may provide an apparatus for supporting a light-emitting diode which includes an LED circuit board including a first major surface and a second major surface. The first major surface may include a first contact pad and a second contact pad, where each of the first contact pad and the second contact pad are configured to receive a respective connector from the LED. The second major surface of the LED circuit board may include a first area, a second area, and a third area, where a substrate is attached to the LED circuit board across the third area.
申请公布号 US9568154(B2) 申请公布日期 2017.02.14
申请号 US201314056419 申请日期 2013.10.17
申请人 Zweibruder Optoelectronics GmbH & Co. KG 发明人 Hansen Sven
分类号 F21K99/00;F21V19/00;F21V23/00;F21Y101/00 主分类号 F21K99/00
代理机构 Alston & Bird LLP 代理人 Alston & Bird LLP
主权项 1. An apparatus for supporting a light-emitting diode (LED), comprising: an alignment member comprising a first element and a second element, wherein an alignment aperture is defined through the first element, wherein the first element surrounds the alignment aperture and is connected to the second element by at least one attachment portion, and wherein an air gap is defined between the first element and the second element; an LED circuit board comprising a first major surface and a second major surface opposing the first major surface, the first major surface comprising a first contact pad and a second contact pad, each of the first contact pad and the second contact pad configured to receive a respective connector from the light-emitting diode, the second major surface comprising a first planar area, a second planar area, and a third area, wherein the circuit board is disposed between the first element and the second element; and a substrate attached to the LED circuit board across the third area of the second major surface; wherein the LED circuit board is attached to the first element with the LED aligned with the alignment aperture and configured to emit light there through, and wherein at least a portion of the LED circuit board and the substrate are aligned with the air gap; wherein the first planar area of the second major surface of the LED circuit board is configured to engage, at a portion of the planar area, a first pin of a light emitting diode driving circuit and the second planar area of the second major surface of the LED circuit board is configured to engage, at a portion of the planar area, a second pin of the light emitting diode driving circuit.
地址 Solingen DE