发明名称 TOOLING FOR A PACKAGE ENCLOSING ELECTRONICS AND METHODS OF USE THEREOF
摘要 The disclosure relates to a precise cut, reusable tooling assembly used to precisely hold and align a package base during manufacture into an electronic package that protects electronic circuits, microelectronic circuits and semiconductors. The assembly comprises a carrier plate and a template, and an optional interface bloc, all of which secure a lower or intermediate section of the outer periphery of the package base to prevent movement of the package base during manufacturing processes. The assembly can also be used to transfer a sealed electronic package between manufacturing process equipment by hand without having to contact the electronic package. The invention includes end effector tooling useful for precisely aligning a lid relative to a package body. The effector tooling includes an angled surface that contacts upper edges of a lid and seal ring.
申请公布号 US2017040195(A1) 申请公布日期 2017.02.09
申请号 US201615229782 申请日期 2016.08.05
申请人 Microcircuit Laboratories LLC 发明人 Richardson Richard;Anders James K.
分类号 H01L21/67;H01L23/02;H01L21/50;H01L21/68 主分类号 H01L21/67
代理机构 代理人
主权项 1. An assembly for handling an electronic package comprising: a template comprising a communication between a top surface and a bottom surface of the template, the communication having an internal peripheral surface that is shaped to correspond with and receive, in whole or in part, an external lateral portion of a base or walls of the electronic package, whereby the communication is configured to removeably secure and position the electronic package in a precise position relative to an assembly operation; and a carrier plate comprising a top surface and a bottom surface, the carrier plate positioned beneath the template, whereby the top surface of the carrier plate and the bottom surface of the template are in contact or are positioned at a distance from one another; whereby the fit of the template with the carrier plate is configured to secure the electronic package along at least the X axis and the Y axis of the carrier plate.
地址 Kennett Square PA US
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