| 摘要 |
PROBLEM TO BE SOLVED: To make restoration from a power saving mode quicker than a conventional apparatus and achieve excellent substrate processing after the restoration.SOLUTION: A plasma substrate processing apparatus processing a substrate in a processing chamber 11 by plasma, comprises: the processing chamber 11; a gas supply unit 20 for supplying processing gas to inside the processing chamber 11; a pl inside plasma production part 25 for producing plasma from the processing gas supplied to the processing chamber 11; heaters 14a and 14b for heating the processing chamber 11; and a control unit 40. The control unit 40 includes: a power saving mode execution part 47 causing power supply to the heaters 14a and 14b to be in a reduced or stopped state and causing power supply to the plasma production part 25 to be in a stopped state; and a restoration mode execution part 48 for restoring power supply to the heaters 14a and 14b and causing power supply to be supplied to the plasma production part 25 to raise internal temperature of the processing chamber 11 to temperature suitable for substrate processing.SELECTED DRAWING: Figure 1 |
