发明名称 |
Bonding pad arrangment design for multi-die semiconductor package structure |
摘要 |
A semiconductor package structure includes a base. A first die is mounted on the base. The first die comprises a plurality of first pads with a first pad area arranged in a first tier. A plurality of second pads with a second pad area is arranged in a second tier. A second die is mounted on the base. The second die includes a plurality of third pads arranged in a third tier. A first bonding wire has two terminals respectively coupled to one of the first pads and one of the third pads. A second bonding wire has two terminals respectively coupled to one of the third pads and one of the second pads. |
申请公布号 |
US9564395(B2) |
申请公布日期 |
2017.02.07 |
申请号 |
US201514809482 |
申请日期 |
2015.07.27 |
申请人 |
MEDIATEK INC. |
发明人 |
Liu Hsing-Chih;Yang Chia-Hao;Chen Ying-Chih |
分类号 |
H01L23/48;H01L23/522;H01L23/538;H01L23/528;H01L23/50;H01L23/495;H01L23/00;H01L25/065 |
主分类号 |
H01L23/48 |
代理机构 |
McClure, Qualey & Rodack, LLP |
代理人 |
McClure, Qualey & Rodack, LLP |
主权项 |
1. A semiconductor package structure, comprising:
a base; a first die mounted on the base, comprising: a plurality of first pads with a first pad area arranged in a first tier; and a plurality of second pads with a second pad area arranged in a second tier, wherein the first pad area is smaller than the second pad area; and a second die mounted on the base, comprising: a plurality of third pads, arranged in a third tier; a first bonding wire having two terminals respectively coupled to one of the first pads and one of the third pads; and a second bonding wire having two terminals respectively coupled to another one of the third pads and one of the second pads. |
地址 |
Hsin-Chu TW |