Semiconductor device package and method of making the same

摘要

A semiconductor device package includes a substrate and a semiconductor device disposed on a surface of the substrate. The semiconductor device includes a first contact pad and a second contact pad disposed on an upper surface of the semiconductor device. The semiconductor device package further includes a conductive bar disposed on the first contact pad, and a conductive pillar disposed on the second contact pad. A method of making a semiconductor device package includes (a) providing a substrate; (b) mounting a semiconductor device on the substrate, wherein the semiconductor device comprises a first contact pad and a second contact pad on an upper surface of the semiconductor device; (c) forming a dielectric layer on the substrate to cover the semiconductor device; (d) exposing the second contact pad by forming a hole in the dielectric layer; and (e) applying a conductive material over the dielectric layer and filling the hole.

主权项

1. A semiconductor device package comprising:
a substrate; a semiconductor device disposed on a surface of the substrate, the semiconductor device including a first contact pad and a second contact pad disposed on an upper surface of the semiconductor device; a dielectric layer disposed on the surface of the substrate and covering the semiconductor device, and further covering a portion of the first contact pad and a portion of the second contact pad; a conductive bar disposed on a remaining portion of the first contact pad exposed by the dielectric layer; and a conductive pillar disposed on a remaining portion of the second contact pad exposed by the dielectric layer.