发明名称 SEMICONDUCTOR DEVICE INCLUDING FIN HAVING CONDENSED CHANNEL REGION
摘要 A finFET semiconductor device includes at least one semiconductor fin on an upper surface of a substrate. The semiconductor fin includes a channel region interposed between opposing source/drain regions. A gate stack is on the upper surface of the substrate and wraps around sidewalls and an upper surface of only the channel region. The channel region further includes a condensed portion formed of a first semiconductor material and a second semiconductor material. The source/drain regions are formed of the first semiconductor material while excluding the second semiconductor material.
申请公布号 US2017033219(A1) 申请公布日期 2017.02.02
申请号 US201514949977 申请日期 2015.11.24
申请人 International Business Machines Corporation 发明人 He Hong;Leobandung Effendi;Tsutsui Gen;Yamashita Tenko
分类号 H01L29/78;H01L29/165;H01L29/161;H01L29/66;H01L29/06 主分类号 H01L29/78
代理机构 代理人
主权项 1. A method of fabricating a finFET device, the method comprising: forming, on an upper surface of a semiconductor substrate, at least one semiconductor fin comprising a first semiconductor material, the at least one semiconductor fin having a channel region interposed between opposing source/drain regions; forming first and second opposing gate spacers that wrap around the exterior surface of the at least one fin and define a gate region that extends between the first and second gate spacers to define a total gate region length; forming a flowable insulator layer on the source/drain regions, and forming a dummy gate stack on the channel region; selectively removing the dummy gate stack with respect to the flowable insulator layer to expose the channel region; forming a condenser layer including a donor material directly on an upper surface and sidewalls of the exposed channel region; performing a condensation process to selectively transform the exposed channel region into a second semiconductor material different from the first semiconductor material so as to increase carrier mobility conductivity of the channel region, while maintaining the first semiconductor material of the source/drain regions, wherein the second semiconductor material has a total condensed channel length extending from an inner side of the first gate spacer to an inner side of the second gate spacer that matches the gate region length.
地址 Armonk NY US