| 发明名称 |
STRUCTURES AND METHODS FOR SEMICONDUCTOR PACKAGING |
| 摘要 |
A semiconductor package including a lead frame having a die pad and a plurality of leads arranged along at least a portion of a periphery of the semiconductor package, a semiconductor die secured to the die pad, wherein at least a portion of the semiconductor die extends beyond a periphery of the die pad, and a molding material encapsulating the semiconductor die and at least a portion of the die pad. |
| 申请公布号 |
US2017033058(A1) |
申请公布日期 |
2017.02.02 |
| 申请号 |
US201615222260 |
申请日期 |
2016.07.28 |
| 申请人 |
Everspin Technologies, Inc. |
发明人 |
LI Quan Bang;LIANG ChingTi |
| 分类号 |
H01L23/00;H01L23/495;H01L23/31 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package, comprising:
a lead frame having a die pad and a plurality of leads arranged along at least a portion of a periphery of the semiconductor package; a semiconductor die secured to the die pad, wherein at least a portion of the semiconductor die extends beyond a periphery of the die pad; and a molding material encapsulating the semiconductor die and at least a portion of the die pad. |
| 地址 |
Chandler AZ US |
