发明名称 CURABLE ADHESIVE COMPOSITIONS AND USE THEREOF
摘要 A solvent-less hybrid curable composition is prepared from grafting polyesters or polyamides onto a (meth)acrylic copolymer backbone. Besides the many benefits of a solvent-less system, the hybrid curable composition forms strong adhesion to polar substrates, widens the use temperatures, and enables faster processing speeds than conventional hybrid curable compositions. The solvent-less hybrid curable composition forms an optically clear single phase that is suitable as tapes and labels, or in electronic, optoelectronic, OLED and photovoltaic devices, and the like.
申请公布号 US2017029559(A1) 申请公布日期 2017.02.02
申请号 US201615292626 申请日期 2016.10.13
申请人 HENKEL IP & HOLDING GMBH 发明人 LU Victor X.;LI Chunzhao
分类号 C08G63/08;C09J167/04 主分类号 C08G63/08
代理机构 代理人
主权项 1. A solvent-less, curable composition comprising a hybrid copolymer having a meth(acrylic copolymer) backbone and a plurality of a monomer or an oligomer grafted onto the meth(acrylic copolymer) backbone, wherein the monomer or the oligomer comprises an —O— or —NH— functional group.
地址 Duesseldorf DE