DEPOSITION SOURCE, VACUUM DEPOSITION APPARATUS, AND METHODS OF OPERATING THEREOF

摘要

A deposition source (100, 200, 201, 300) for sputter deposition is described. The deposition source includes: a cathode (130, 230) for providing a target material to be deposited; at least one anode assembly (110, 210) having at least a first anode segment (111, 211) which faces a first portion of the cathode and a second anode segment (112, 212) which faces a second portion of the cathode; and a connector assembly (120). The connector assembly includes: a first electric connection (121) for connecting the first anode segment (111, 211) to a first reference potential (PI); a second electric connection (122) for connecting the second anode segment (112, 212) to a second reference potential (P2); and an adjusting means (150) for adjusting at least one of a first electric resistance of the first electric connection (121) and a second electric resistance of the second electric connection (122).