ELECTRONIC COMPONENT MOUNTING APPARATUS

摘要

An electronic component mounting apparatus (1) includes: a mounting head (6) including a holder (5) for extracting an electronic component from the component feeding unit (8) and mounting the electronic component onto a substrate, the mounting head being movable in a horizontal direction; an imaging camera (20) disposed on the mounting head for imaging a component extraction position where a component is to be extracted from the component feeding unit, when the holder is at the component extraction position; a recognition unit (28) for recognizing, based on an image captured by the imaging camera, a positional deviation between the component extraction position and a position of a housing portion where a component is stored in the component feeding unit or a position of the component in the housing portion; and a controller (25) for correcting the component extraction position to a position shifted by a positional deviation recognized by the recognition unit based on an image captured by the imaging camera before the component feeding unit extracts a subsequent component, and causing the mounting head to move to the corrected position.