| 摘要 |
Provided are a light emitting device package, a backlight unit, a lighting device and its manufacturing method. The light emitting device package may include a flip chip type light emitting device having a first pad and a second pad, a lead frame that includes a first electrode disposed at one side of an electrode separation space, and a second electrode disposed at the other side of the electrode separation space, and on which the light emitting device is mounted, a first bonding medium formed between the first pad of the light emitting device and the first electrode of the lead frame to electrically connect the first pad and the first electrode, and a second bonding medium formed between the second pad of the light emitting device and the second electrode of the lead frame to electrically connect the second pad and the second electrode, wherein at least one first accommodating cup capable of accommodating the first bonding medium is formed in the first electrode of the lead frame, wherein at least one second accommodating cup capable of accommodating the second bonding medium is formed in the second electrode of the lead frame, and wherein at least one air discharge path is formed on each of the first and second accommodating cups. |
