| 摘要 |
PROBLEM TO BE SOLVED: To reduce dispersion in the thickness of a sealing resin when electronic parts are resin-sealed by compression molding by using a powdery or granular material for resin sealing.SOLUTION: When a chip 14 is resin-sealed by using a molding die for compression molding with a cavity 4 arranged in a resin sealing device, a powdery or granular material 5 for resin sealing is used as a raw material for resin sealing. The material for resin sealing satisfies a second standard that a grain diameter D is D≤3×t(mm) when it has a first standard that a target value of the thickness of the sealing resin is t(mm). The material 5 for resin sealing is formed of a material within the first standard, which is determined to satisfy the second standard as a result of selection performed by the time it is supplied to the cavity 4 after being supplied to the resin sealing device. The first standard is 0.03(mm)≤t≤1.0(mm). |
