发明名称 半導体試験装置
摘要 The invention provides a semiconductor test device, refers to a comprehensive semiconductor test device with a plurality of testers, and can prevent metal fatigue of wirings connected with the testers. The semiconductor test device combines DC characteristic tests carried out by a DC tester and AC characteristic tests carried out by an AC tester; and comprises the following structures: a lower movable structure (57) for fixing DUT (testing element); an upper movable structure (59) comprising a terminal group (62) connected with the DC tester and the AC tester and cylinders (53, 54) with a short circuit electrode (71); and a fixing tool for fixing a wiring group (61) is configured between the upper movable structure and the lower movable structure. An expansion cylinder (53) enables the wiring group (61) to be disconnected from the terminal group (62) when the DC test is carried out, and the expansion cylinder (53) enables the wiring group (61) to be disconnected from the terminal group (62).
申请公布号 JP6069831(B2) 申请公布日期 2017.02.01
申请号 JP20110275167 申请日期 2011.12.16
申请人 富士電機株式会社 发明人 野中 智己
分类号 G01R31/26 主分类号 G01R31/26
代理机构 代理人
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