Magnesium-based composite member, heat radiation member, and semiconductor device

摘要

A magnesium-based composite member is provided with a through hole through which a fastening member for attachment to a fixing target is to be inserted. A substrate is provided with a substrate hole through which the fastening member is to be inserted, and made of a composite material which is a composite of SiC and a matrix metal which is any of magnesium and a magnesium alloy. A receiving portion is attached to the substrate and made of a metal material different from the matrix metal. The receiving portion is provided with a receiving portion hole through which the fastening member is to be inserted, and at least a part of an inner circumferential surface of the through hole is formed from an inner circumferential surface of the receiving portion hole.

主权项

1. A magnesium-based composite member provided with a through hole through which a fastening member for attachment is to be inserted, comprising:
a substrate provided with a substrate hole through which said fastening member is to be inserted and composed of a composite material of SiC and a matrix metal which is any of magnesium and a magnesium alloy; and a receiving portion attached to said substrate and composed of a metal material different from said matrix metal, said receiving portion being provided with a receiving portion hole through which said fastening member is to be inserted, and at least a part of an inner circumferential surface of said through hole being formed from an inner circumferential surface of said receiving portion hole, and in said matrix metal, said SiC is present in a form of a porous body having open pores, the open pores of the porous body are filled with the matrix metal.