POWER MODULE PACKAGE

摘要

A power module package includes a single-layered circuit board, a first electronic component, and a second electronic component. The single-layered circuit board includes an insulating substrate and a conductive layer thereon. A bottom surface of the conductive layer touches a top surface of the insulating substrate. The insulating substrate has plural first openings to allow the conductive layer to be exposed from the bottom surface of the insulating substrate. The first electronic component is disposed on a top surface of the conductive layer. The second electronic component is disposed on the bottom surface of the insulating substrate and received in the first openings. The second electronic component is connected to the conductive layer via the first openings. At least one of the first electronic component and the second electronic component is a bare die.

主权项

1. A power module package comprising:
a single-layered circuit board comprising an insulating substrate and a conductive layer disposed on the insulating substrate, the insulating substrate having a top surface and a bottom surface opposite to each other, the conductive layer having a top surface and a bottom surface opposite to each other, wherein the bottom surface of the conductive layer touches the top surface of the insulating substrate, and the insulating substrate has a plurality of first openings to allow the bottom surface of the conductive layer to be exposed from the bottom surface of the insulating substrate; a first electronic component disposed on the top surface of the conductive layer; and a second electronic component disposed on the bottom surface of the insulating substrate and received in the first openings, wherein the second electronic component is connected to the conductive layer via the first openings, and at least one of the first electronic component and the second electronic component is a bare die.