| 发明名称 |
HEAT-ACTIVATED ADHESIVE COMPOSITION |
| 摘要 |
A high solids radiation-curable coating comprises at least one acrylated oligomer component and a component soluble in the acrylated component that solidifies when the acrylated coating cures. The coating dries upon radiation cure and remains dry to a temperature of at least 60° C. and is bondable at a higher temperature. The formulations have significant utility as a dry to the touch adhesive that can be applied to a wide variety of substrates, and has particular applicability in the printing industry. |
| 申请公布号 |
US2017022401(A1) |
申请公布日期 |
2017.01.26 |
| 申请号 |
US201514806987 |
申请日期 |
2015.07.23 |
| 申请人 |
ACTEGA Radcure, Inc. |
发明人 |
ARNOLD John |
| 分类号 |
C09J133/14;B05D3/06 |
主分类号 |
C09J133/14 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A radiation-curable adhesive coating, comprising:
at least one acrylated oligomer component; and a component soluble in the acrylated component that solidifies when the acrylated coating cures, such that the coating dries upon radiation cure and remains dry to a temperature of at least 60° C. and is bondable at a higher temperature, the coating being free of additional tackifier or surfactant components. |
| 地址 |
Cinnaminson NJ US |
