| 摘要 |
This electronic device is provided with: a circuit board (10) having two lands (11) which are parts of wiring; a mounting component (20), which is mounted on the circuit board (10), and which has two electrodes (22) respectively facing the lands (11); and two solder sections (30), which bond the lands (11) and electrode (22) portions which the lands (11) face. In a region where the circuit board (10) and the mounting component (20) face each other, a facing space (50), which is sandwiched between the two solder sections, and is opened at both ends, is formed. The facing space (50) includes a narrow portion having an opening area that is smaller than the opening area at both the ends of the facing space. |
